| Single-Sided High-Temperature Masking Tape | 1–2 mil 25–50 µm | 2.5–4.5 mil 64–114 µm | Silicone pressure-sensitive adhesive | Polyimide film can support continuous exposure near 260°C; practical tape performance depends on adhesive grade, dwell time, and substrate. | Excellent heat resistance, clean removal when properly specified, good dielectric strength, and strong dimensional stability. | Wave soldering, reflow masking, powder coating, coil insulation, and protection of gold-plated contacts. | Check residue, peel adhesion after heating, removal temperature, and compatibility with soldering or coating processes. |
| Ultra-Thin Polyimide Tape | 0.5–1 mil 13–25 µm | 1.5–3 mil 38–76 µm | Thin silicone adhesive | Suitable for high-temperature processing when the adhesive is qualified; the 260°C rating should not be assumed for every construction. | Low profile, flexible, conformable, and suitable where tight tolerances or minimal added thickness are important. | Fine-pitch electronics, flexible circuits, sensor assembly, battery insulation, and temporary component protection. | Review tear resistance, handling strength, liner release, and whether the thin adhesive layer provides sufficient holding power. |
| Heavy-Duty Single-Sided Polyimide Tape | 3–5 mil 76–127 µm | 4.5–7.5 mil 114–191 µm | Silicone pressure-sensitive adhesive | Designed for demanding thermal and mechanical handling; actual continuous-use limits are determined by the complete tape construction. | Higher puncture resistance, better edge handling, improved tear resistance, and greater mechanical protection than thinner films. | Transformer and motor insulation, busbar protection, high-temperature bundling, and industrial masking. | Confirm roll flexibility, minimum bend radius, tensile strength, edge lift, and adhesion to rough or powder-coated surfaces. |
| Double-Sided Polyimide Mounting Tape | 1–2 mil 25–50 µm carrier | 3–8 mil 76–203 µm | Silicone adhesive on both sides | The polyimide carrier withstands high temperatures; bonding performance at elevated temperature is controlled by both adhesive layers. | High-temperature bonding, good conformability, and secure attachment without mechanical fasteners. | Heater attachment, flexible circuit reinforcement, component mounting, and insulation-layer bonding. | Assess shear strength, outgassing, liner removal, substrate surface energy, and bond performance after thermal cycling. |
| Acrylic-Adhesive Polyimide Tape | 0.5–2 mil 13–50 µm | 1.5–4.5 mil 38–114 µm | Acrylic pressure-sensitive adhesive | Often selected for stronger room-temperature adhesion; many acrylic constructions have lower continuous-temperature limits than silicone systems and should not automatically be rated at 260°C. | Good adhesion to selected metals, plastics, and coated surfaces; may offer higher initial tack and different residue behavior. | General electronic assembly, insulation, label attachment, and applications requiring adhesion to difficult substrates. | Prioritize temperature rating, aging behavior, chemical resistance, plasticizer compatibility, and peel adhesion after heat exposure. |
| Antistatic Polyimide Tape | 1–2 mil 25–50 µm | 2.5–5 mil 64–127 µm | Silicone or acrylic adhesive with antistatic formulation | Thermal capability varies by adhesive and antistatic treatment; verify electrical and thermal properties after the intended heat cycle. | Helps reduce electrostatic charge generation during tape removal and handling; electrical performance is formulation-dependent. | ESD-sensitive electronics, semiconductor handling, clean assembly areas, and protection of static-sensitive surfaces. | Request surface resistivity, charge-generation data, humidity conditions, outgassing data, and ESD test method. |
| Flame-Retardant Polyimide Tape | 1–3 mil 25–76 µm | 2.5–6 mil 64–152 µm | Specialty silicone or acrylic adhesive | Polyimide film is inherently heat-resistant, but flame-retardant classification and continuous-temperature performance must be verified for the entire tape. | Improved resistance to ignition or flame propagation when specifically formulated and tested; maintains electrical insulation in demanding assemblies. | Wire and cable insulation, battery packs, power electronics, and transportation-related electrical assemblies. | Do not rely only on the film rating; request the complete tape's flammability test, dielectric data, and aging results. |
| Low-Outgassing Polyimide Tape | 1–2 mil 25–50 µm | 2.5–5 mil 64–127 µm | Low-outgassing silicone adhesive | Suitable for controlled thermal environments when supported by vacuum or thermal-aging test data; 260°C continuous use requires construction-specific validation. | Reduced volatile release compared with standard constructions, stable insulating film, and clean performance in controlled environments. | Optical instruments, vacuum equipment, aerospace electronics, sensors, and high-cleanliness assemblies. | Request total mass loss, collected volatile condensable material, outgassing test conditions, and storage-life data. |
| Technical note: “260°C continuous use” generally refers to the thermal capability of the polyimide film, not an automatic rating for every finished adhesive tape. Continuous-use temperature, short-term peak temperature, adhesion retention, residue, dielectric strength, and outgassing should be confirmed using the complete tape construction and the buyer’s actual process conditions. |